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Sample plan creation and full chip coverage for optical proximity correction models / Mohammad Kamel Abdelfattah Kamel Moawad ; Supervised Ahmed Hussein Khalil , Hossam Aly Hassan Fahmy

By: Contributor(s): Material type: TextTextLanguage: English Publication details: Cairo : Mohammad Kamel Abdelfattah Kamel Moawad , 2015Description: 102 P. : charts ; 30cmOther title:
  • خطة إنشاء العينات والتغطية لكل معاملات صورة الدائرة بهدف النمذجة لتصحيح القرب الضوئي [Added title page title]
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  • Issued also as CD
Dissertation note: Thesis (M.Sc.) - Cairo University - Faculty of Engineering - Department of Electronics and Communications Summary: Photolithography is used in integrated circuit manufacturing. Feature reduction challenge requires resolution enhancement techniques with the limitations imposed on the wavelength used. Optical proximity correction is one of the resolution enhancement techniques. Optical proximity correction requires predictive process models. In this study, a new methodology is introduced for the sample plan creation based on full chip image parameter coverage analysis. The generated sample plan aims to provide more predictive photoresist models for the lithography process
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Item type Current library Home library Call number Copy number Status Barcode
Thesis Thesis قاعة الرسائل الجامعية - الدور الاول المكتبة المركزبة الجديدة - جامعة القاهرة Cai01.13.08.M.Sc.2015.Mo.S (Browse shelf(Opens below)) Not for loan 01010110068484000
CD - Rom CD - Rom مخـــزن الرســائل الجـــامعية - البدروم المكتبة المركزبة الجديدة - جامعة القاهرة Cai01.13.08.M.Sc.2015.Mo.S (Browse shelf(Opens below)) 68484.CD Not for loan 01020110068484000

Thesis (M.Sc.) - Cairo University - Faculty of Engineering - Department of Electronics and Communications

Photolithography is used in integrated circuit manufacturing. Feature reduction challenge requires resolution enhancement techniques with the limitations imposed on the wavelength used. Optical proximity correction is one of the resolution enhancement techniques. Optical proximity correction requires predictive process models. In this study, a new methodology is introduced for the sample plan creation based on full chip image parameter coverage analysis. The generated sample plan aims to provide more predictive photoresist models for the lithography process

Issued also as CD

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