header
Local cover image
Local cover image
Image from OpenLibrary

Design of uncooled thermal imaging system / Mohammed Talaat Faraag Ali ; Supervised Serag_ElDin Elsayed Habib , Sherif Sedky

By: Contributor(s): Language: Eng Publication details: Cairo : Mohammed Talaat Faraag Ali , 2006Description: 148p : ill ; 30cmOther title:
  • تصميم كاميرات الرؤيا الليلية الغير مبردة [Added title page title]
Subject(s): Online resources: Available additional physical forms:
  • Issued also as CD
Dissertation note: Thesis (M.Sc.) - Cairo University - Faculty Of Engineering - Department Of Electronics and Communications Summary: Focal plane Arrays (FPAs) are the counter parts of the CCDs in the medium and Far Infrared regionsRecent advances in the MicroElectroMechanical (MEMS) technology enabled the development of single chip uncooled FPAs of high resolution (several hundred pixels per axis) As a result , significant strides are in progress towards building low cost , high resolution , uncooled , thermal imaging systems for scientific , commercial , and military applicationsThe improvement of such FPAs is a result of synergetic developments in the following three fields : highly sensitive materials development , process fabrication enhancement and sensitive Read Out Integrated Circuit (ROIC) design
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
Holdings
Item type Current library Home library Call number Status Barcode
Thesis Thesis قاعة الرسائل الجامعية - الدور الاول المكتبة المركزبة الجديدة - جامعة القاهرة Cai01.13.08.M.Sc.2006.Mo.D. (Browse shelf(Opens below)) Not for loan 01010110046251000
CD - Rom CD - Rom مخـــزن الرســائل الجـــامعية - البدروم المكتبة المركزبة الجديدة - جامعة القاهرة Cai01.13.08.M.Sc.2006.Mo.D. (Browse shelf(Opens below)) Not for loan 01020110046251000

Thesis (M.Sc.) - Cairo University - Faculty Of Engineering - Department Of Electronics and Communications

Focal plane Arrays (FPAs) are the counter parts of the CCDs in the medium and Far Infrared regionsRecent advances in the MicroElectroMechanical (MEMS) technology enabled the development of single chip uncooled FPAs of high resolution (several hundred pixels per axis) As a result , significant strides are in progress towards building low cost , high resolution , uncooled , thermal imaging systems for scientific , commercial , and military applicationsThe improvement of such FPAs is a result of synergetic developments in the following three fields : highly sensitive materials development , process fabrication enhancement and sensitive Read Out Integrated Circuit (ROIC) design

Issued also as CD

There are no comments on this title.

to post a comment.

Click on an image to view it in the image viewer

Local cover image