Dynamic thermal investigation of ultra- thin silicon chips /
Ahmed Nabil Abdelrahman Elsayed
Dynamic thermal investigation of ultra- thin silicon chips / Ahmed Nabil Abdelrahman Elsayed ; Supervised Joachim N. Burghartz , Ahmed H. Madian - Cairo : Ahmed Nabil Abdelrahman Elsayed , 2015 - 85 Leaves : chart , facsimiles ; 30cm
Thesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics
In recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics
Dynamic thermal investigation Silicon chips Ultra- thin silicon chips
Dynamic thermal investigation of ultra- thin silicon chips / Ahmed Nabil Abdelrahman Elsayed ; Supervised Joachim N. Burghartz , Ahmed H. Madian - Cairo : Ahmed Nabil Abdelrahman Elsayed , 2015 - 85 Leaves : chart , facsimiles ; 30cm
Thesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics
In recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics
Dynamic thermal investigation Silicon chips Ultra- thin silicon chips