Ahmed Nabil Abdelrahman Elsayed <br/><br/>
Dynamic thermal investigation of ultra- thin silicon chips /  
Ahmed Nabil Abdelrahman Elsayed ; Supervised Joachim N. Burghartz , Ahmed H. Madian 
 - Cairo :   Ahmed Nabil Abdelrahman Elsayed ,   2015 
 - 85 Leaves :   chart , facsimiles ;   30cm 
<br/><br/>Thesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics 
<br/><br/> In recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics 
<br/><br/><label>Subjects--Index Terms: </label>Dynamic thermal investigation  Silicon chips Ultra- thin silicon chips