TY  - BOOK
AU  - Ahmed Nabil Abdelrahman Elsayed
AU  - Ahmed H. Madian , 
AU  - Joachim N.Burghartz , 
TI  - Dynamic thermal investigation of ultra- thin silicon chips / 
PY  - 2015///
CY  - Cairo : 
PB  - Ahmed Nabil Abdelrahman Elsayed , 
KW  - Dynamic thermal investigation
KW  - Silicon chips
KW  - Ultra- thin silicon chips
N1  - Thesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics
N2  - In recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics
UR  - http://172.23.153.220/th.pdf
ER  -