| 000 | 01466cam a2200313 a 4500 | ||
|---|---|---|---|
| 003 | EG-GiCUC | ||
| 005 | 20250223031748.0 | ||
| 008 | 170730s2015 ua dh f m 000 0 eng d | ||
| 040 |
_aEG-GiCUC _beng _cEG-GiCUC |
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| 041 | 0 | _aeng | |
| 049 | _aGift | ||
| 097 | _aM.Sc | ||
| 099 | _aCai01.34.M.Sc.2015.Ah.D | ||
| 100 | 0 | _aAhmed Nabil Abdelrahman Elsayed | |
| 245 | 1 | 0 |
_aDynamic thermal investigation of ultra- thin silicon chips / _cAhmed Nabil Abdelrahman Elsayed ; Supervised Joachim N. Burghartz , Ahmed H. Madian |
| 260 |
_aCairo : _bAhmed Nabil Abdelrahman Elsayed , _c2015 |
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| 300 |
_a85 Leaves : _bchart , facsimiles ; _c30cm |
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| 502 | _aThesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics | ||
| 520 | _aIn recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics | ||
| 653 | 4 | _aDynamic thermal investigation | |
| 653 | 4 | _aSilicon chips | |
| 653 | 4 | _aUltra- thin silicon chips | |
| 700 | 0 |
_aAhmed H. Madian , _esupervisor |
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| 700 | 0 |
_aJoachim N.Burghartz , _esupervisor |
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| 856 | _uhttp://172.23.153.220/th.pdf | ||
| 905 |
_aNazla _eRevisor |
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| 905 |
_aShimaa _eCataloger |
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| 942 |
_2ddc _cTH |
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_c61709 _d61709 |
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