Dynamic thermal investigation of ultra- thin silicon chips / Ahmed Nabil Abdelrahman Elsayed ; Supervised Joachim N. Burghartz , Ahmed H. Madian
Material type:
TextLanguage: English Publication details: Cairo : Ahmed Nabil Abdelrahman Elsayed , 2015Description: 85 Leaves : chart , facsimiles ; 30cmSubject(s): Online resources: Dissertation note: Thesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics Summary: In recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics
| Item type | Current library | Home library | Call number | Status | Barcode | |
|---|---|---|---|---|---|---|
Thesis
|
قاعة الثقاقات الاجنبية - الدور الثالث | المكتبة المركزبة الجديدة - جامعة القاهرة | Cai01.34.M.Sc.2015.Ah.D (Browse shelf(Opens below)) | Not for loan | 01010110072165000 |
Thesis (M.Sc. .) - German University - Faculty of Postgraduate Studies and Scientific Research - Department of Elctronics
In recent years, the industry has witnessed a growing trend and demand for flexible elctronics and 3D integrated circuits. This trend posed a need for the overall volume reduction of silicon chips. Current traditional silicon bulk chip have thicknesses ranging 200 - 500 um, while maintaining poor mechanical characteristics
There are no comments on this title.
Click on an image to view it in the image viewer